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To 218 package dimensions example

23.11.2019

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From Wikipedia, the free encyclopedia. The junction-to-case thermal resistance of a TO packaged device which typically matters less than the case-to-ambient thermal resistancedepends on the thickness and the area of the semiconductor die inside the package, typically in a range between 0. These devices operate at DC or relatively low audio frequencies, since the TO package is not intended for devices operating at radio frequencies. This does not normally pose a problem when using isolated heatsinks, but an electrically-insulating pad or sheet may be required to electrically isolate the component from the heatsink if the heatsink is electrically conductive, grounded or otherwise non-isolated. In addition to bipolar, bipolar Darlington, and power MOSFET transistors, the TO case is also used for fixed and variable linear voltage regulator integrated circuits, and for Schottky diode pairs. TO front view [1]. In applications that require a heatsink, damage or destruction of the TO device due to overheating may occur if the heatsink is dislodged during operation. Retrieved 24 May


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    Video: To 218 package dimensions example What are Dimensions and Measures?

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    images to 218 package dimensions example

    This FPCN announces the package change of all TO Bipolar Power Transistors currently CRITICAL DIMENSIONS, TO vs TO Document Number: For technical questions concerning discrete products, contact: [email protected] Revision.
    Semiconductor packages. In addition to bipolar, bipolar Darlington, and power MOSFET transistors, the TO case is also used for fixed and variable linear voltage regulator integrated circuits, and for Schottky diode pairs.

    TO packages can be mounted to a heat sink to dissipate several watts of waste heat.

    images to 218 package dimensions example

    In applications that require a heatsink, damage or destruction of the TO device due to overheating may occur if the heatsink is dislodged during operation. Wikimedia Commons has media related to TO transistor packages.

    The TO case is found on semiconductor devices handling less than 20 amperes and operating at less than a few hundred volts.

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    The TO package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink[3] allowing the component to dissipate more heat than one constructed in a TO case.

    Categories : Semiconductor packages.

    TO front view [1]. Wikimedia Commons has media related to TO transistor packages. Electronic packaging Integrated circuit packaging List of integrated circuit packaging types Printed circuit board Surface-mount technology Through-hole technology.

    The transistor outline (TO) package family consists of many types of packaging solutions for transistors TO - Transistor Outline Package, Case Style 2 +1 Lead Form Dimensions Example: QF (Signifies Type 12) TO) away from the package body with a minimum radius of.

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    Video: To 218 package dimensions example How to measure a box

    The TO is a style of electronic package used for high-powered, through-hole components The TO package is a "power package" intended for power semiconductors and an example of a through-hole design rather in favor of clip​-mounting, thus claiming TOlike thermal performance in a TO footprint.
    A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink[3] allowing the component to dissipate more heat than one constructed in a TO case.

    Categories : Semiconductor packages. March 24, There are a number of variations on this outline, [1] [8] such as:. If more heat needs to be dissipated, devices in the also widely used TO or TO-3P package can be selected.

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    Wikimedia Commons has media related to TO transistor packages.

    There are a number of variations on this outline, [1] [8] such as:. Archived from the original PDF on June 18, Note: It's relatively common to find packages that contain other components than their designated ones, such as diodes or voltage regulators in transistor packages, etc. The junction-to-case thermal resistance of a TO packaged device which typically matters less than the case-to-ambient thermal resistancedepends on the thickness and the area of the semiconductor die inside the package, typically in a range between 0.

    TO front view [1]. The TO package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package.

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    1. There are a number of variations on this outline, [1] [8] such as:. In addition to bipolar, bipolar Darlington, and power MOSFET transistors, the TO case is also used for fixed and variable linear voltage regulator integrated circuits, and for Schottky diode pairs.

    2. The "TO" designation stands for "transistor outline". There also some vendor-specific variations such as International Rectifier 's SUPER, which dispenses with the hole in favor of clip-mounting, thus claiming TOlike thermal performance in a TO footprint.

    3. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink[3] allowing the component to dissipate more heat than one constructed in a TO case. TO back view [1].