From Wikipedia, the free encyclopedia. The junction-to-case thermal resistance of a TO packaged device which typically matters less than the case-to-ambient thermal resistancedepends on the thickness and the area of the semiconductor die inside the package, typically in a range between 0. These devices operate at DC or relatively low audio frequencies, since the TO package is not intended for devices operating at radio frequencies. This does not normally pose a problem when using isolated heatsinks, but an electrically-insulating pad or sheet may be required to electrically isolate the component from the heatsink if the heatsink is electrically conductive, grounded or otherwise non-isolated. In addition to bipolar, bipolar Darlington, and power MOSFET transistors, the TO case is also used for fixed and variable linear voltage regulator integrated circuits, and for Schottky diode pairs. TO front view . In applications that require a heatsink, damage or destruction of the TO device due to overheating may occur if the heatsink is dislodged during operation. Retrieved 24 May
Video: To 218 package dimensions example What are Dimensions and Measures?
NOTES. MIN. MAX.
MIN. MAX. A. .
. A1. - b. - c.
This FPCN announces the package change of all TO Bipolar Power Transistors currently CRITICAL DIMENSIONS, TO vs TO Document Number: For technical questions concerning discrete products, contact: [email protected] Revision.
Semiconductor packages. In addition to bipolar, bipolar Darlington, and power MOSFET transistors, the TO case is also used for fixed and variable linear voltage regulator integrated circuits, and for Schottky diode pairs.
TO packages can be mounted to a heat sink to dissipate several watts of waste heat.
In applications that require a heatsink, damage or destruction of the TO device due to overheating may occur if the heatsink is dislodged during operation. Wikimedia Commons has media related to TO transistor packages.
The TO case is found on semiconductor devices handling less than 20 amperes and operating at less than a few hundred volts.
Video: To 218 package dimensions example How to measure a box
The TO is a style of electronic package used for high-powered, through-hole components The TO package is a "power package" intended for power semiconductors and an example of a through-hole design rather in favor of clip-mounting, thus claiming TOlike thermal performance in a TO footprint.
A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink allowing the component to dissipate more heat than one constructed in a TO case.
Categories : Semiconductor packages. March 24, There are a number of variations on this outline,   such as:. If more heat needs to be dissipated, devices in the also widely used TO or TO-3P package can be selected.